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LPC1833JET100E Tech Specifications

NXP  LPC1833JET100E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 100-TFBGA
Surface Mount YES
Data Converters A/D 4x10b; D/A 1x10b
Number of I/Os 49I/Os
ROM(word) 524288
Operating Temperature -40°C~105°C TA
Packaging Tray
Series LPC18xx
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100Terminations
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Base Part Number LPC1833
Pin Count 100
JESD-30 Code S-PBGA-B100
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2.5/3.3V
Supply Voltage-Min (Vsup) 2.2V
Oscillator Type Internal
Speed 180MHz
RAM Size 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M3
Peripherals Brown-out Detect/Reset, DMA, I2S, POR, WDT
Clock Frequency 25MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
EEPROM Size 16K x 8
CPU Family CORTEX-M3
Length 9mm
Width 9mm
RoHS Status ROHS3 Compliant
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