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LPC11U68JBD100E Tech Specifications

NXP  LPC11U68JBD100E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface Mount YES
Data Converters A/D 12x12b
Number of I/Os 80I/Os
ROM(word) 262144
Operating Temperature -40°C~105°C TA
Packaging Tray
Series LPC11Uxx
Published 2010
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100Terminations
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number LPC11U
Pin Count 100
JESD-30 Code S-PQFP-G100
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.4V
Oscillator Type Internal
Speed 50MHz
RAM Size 36K x 8
Voltage - Supply (Vcc/Vdd) 2.4V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Clock Frequency 25MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
EEPROM Size 4K x 8
On Chip Program ROM Width 8
Length 14mm
Height Seated (Max) 1.6mm
Width 14mm
RoHS Status ROHS3 Compliant
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