LM75BDP,118 Tech Specifications

NXP  LM75BDP,118 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Surface Mount YES
Test Conditions -25°C ~ 100°C (-55°C ~ 125°C)
Usage Level Military grade
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Published 2002
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
HTS Code 8542.39.00.01
Voltage - Supply 2.8V~5.5V
Pin Count 8
Body Length or Diameter 3mm
Body Breadth 3 mm
Output Type I2C
Power Supplies 3/5V
Termination Type SOLDER
Number of Bits 11Bits
Resolution 11 b
Sensor Type Digital, Local
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Housing PLASTIC
Accuracy - Highest (Lowest) ±2°C (±3°C)
Sensing Temperature - Local -55°C~125°C
Accuracy-Max 3 Cel
Output Interface Type 2-WIRE INTERFACE
Features Output Switch, Programmable Limit
Body Height 1.1mm
RoHS Status ROHS3 Compliant
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LM75BDP,118 Documents

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LM75BDP,118 brand manufacturers: NXP USA Inc., Twicea stock, LM75BDP,118 reference price.NXP USA Inc.. LM75BDP,118 parameters, LM75BDP,118 Datasheet PDF and pin diagram description download.You can use the LM75BDP,118 Temperature Sensors - Analog and Digital Output, DSP Datesheet PDF, find LM75BDP,118 pin diagram and circuit diagram and usage method of function,LM75BDP,118 electronics tutorials.You can download from the Twicea.