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ISP1362EE-T Tech Specifications

NXP  ISP1362EE-T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 64Terminals
Package Description FBGA, BGA64,10X10,20
Package Style GRID ARRAY, FINE PITCH
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA64,10X10,20
Operating Temperature-Min -40 °C
Supply Voltage-Nom 3.3 V
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number ISP1362EE-T
Package Code FBGA
Package Shape SQUARE
Manufacturer NXP Semiconductors
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 8.57
Pbfree Code No
Subcategory Bus Controllers
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B64
Qualification Status Not Qualified
Power Supplies 3.3 V
Temperature Grade INDUSTRIAL
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ISP1362EE-T brand manufacturers: NXP USA Inc., Twicea stock, ISP1362EE-T reference price.NXP USA Inc.. ISP1362EE-T parameters, ISP1362EE-T Datasheet PDF and pin diagram description download.You can use the ISP1362EE-T Interface - Controllers, DSP Datesheet PDF, find ISP1362EE-T pin diagram and circuit diagram and usage method of function,ISP1362EE-T electronics tutorials.You can download from the Twicea.