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HEF4043BPN Tech Specifications

NXP  HEF4043BPN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 16Terminals
RoHS Compliant
Package Description DIP, DIP16,.3
Package Style IN-LINE
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP16,.3
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number HEF4043BPN
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 5.73
Prop. 180 ns
JESD-609 Code e3
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 85 °C
Min Operating Temperature -40 °C
Subcategory FF/Latches
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 4Functions
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T16
Qualification Status Not Qualified
Polarity Non-Inverting
Power Supplies 5/15 V
Temperature Grade INDUSTRIAL
Number of Circuits 4Circuits
Max Supply Voltage 15.5 V
Min Supply Voltage 4.5 V
Number of Bits 1Bit
Propagation Delay 25 ns
Output Characteristics 3-STATE
Logic IC Type R-S LATCH
Max I(ol) 0.00036 A
High Level Output Current -3.6 mA
Low Level Output Current 32 mA
Number of Input Lines 8Input Lines
Number of Output Lines 4Output Lines
Lead Free Lead Free
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