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HEF40373BPN Tech Specifications

NXP  HEF40373BPN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 20Terminals
Package Description DIP, DIP20,.3
Package Style IN-LINE
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP20,.3
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number HEF40373BPN
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 5.73
Prop. 300 ns
Subcategory FF/Latches
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T20
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Number of Bits 8Bits
Output Characteristics 3-STATE
Logic IC Type D LATCH
Max I(ol) 0.00175 A
Power Supply Current-Max (ICC) 100 mA
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