NXP USA Inc. HEF40175BTD Flip Flops
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HEF40175BTD Tech Specifications
NXP HEF40175BTD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 16Terminals | |
| Package Description | SOP, SOP16,.25 | |
| Package Style | SMALL OUTLINE | |
| Load Capacitance (CL) | 50 pF | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | SOP16,.25 | |
| Operating Temperature-Min | -40 °C | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | HEF40175BTD | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Philips Semiconductors | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Max | 5000000 Hz | |
| Risk Rank | 5.74 | |
| JESD-609 Code | e4 | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Subcategory | FF/Latches | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Number of Functions | 4Functions | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDSO-G16 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 5/15 V | |
| Temperature Grade | INDUSTRIAL | |
| Logic IC Type | D FLIP-FLOP | |
| Max I(ol) | 0.00036 A | |
| Trigger Type | POSITIVE EDGE |
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