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FXOS8700CQR1 Tech Specifications

NXP  FXOS8700CQR1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 16-LFQFN Module
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2011
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 2.5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQCC-N16
Qualification Status Not Qualified
Output Type I2C, SPI
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.82.5V
Supply Voltage-Min (Vsup) 1.95V
Analog IC - Other Type ANALOG CIRCUIT
Sensor Type Accelerometer, Magnetometer, 6 Axis
Length 3mm
Height Seated (Max) 1.2mm
Width 3mm
RoHS Status ROHS3 Compliant
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FXOS8700CQR1 Documents

Download datasheets and manufacturer documentation for   FXOS8700CQR1

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