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DSPB56367AG150 Tech Specifications

NXP  DSPB56367AG150 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series DSP56K/Symphony
Published 2002
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Type Audio Processor
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSPB56367
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Supply Voltage-Min (Vsup) 1.71V
Interface Host Interface, I2C, SAI, SPI
Clock Frequency 150MHz
Address Bus Width 18
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 24
Format FIXED POINT
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (240kB)
Voltage - Core 1.80V
On Chip Data RAM 69kB
Clock Rate 150MHz
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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