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DSP56F801FA60E Tech Specifications

NXP  DSP56F801FA60E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 11I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series 56F8xx
Published 1998
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSP56F801
JESD-30 Code S-PQFP-G48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Oscillator Type Internal
Speed 60MHz
RAM Size 1K x 16
Voltage - Supply (Vcc/Vdd) 3V~3.6V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor 56800
Peripherals POR, PWM, WDT
Clock Frequency 60MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 16KB 8K x 16
Connectivity SCI, SPI
Bit Size 16
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
RAM (words) 1024
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Length 7mm
Height Seated (Max) 1.6mm
Width 7mm
RoHS Status ROHS3 Compliant
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