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DSP56303VL100 Tech Specifications

NXP  DSP56303VL100 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 196-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series DSP563xx
Published 1999
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 196Terminations
ECCN Code 3A991.A.2
Type Fixed Point
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSP56303
JESD-30 Code S-PBGA-B196
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Interface Host Interface, SSI, SCI
Clock Frequency 100MHz
Address Bus Width 18
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 24
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
Length 15mm
Height Seated (Max) 1.6mm
Width 15mm
RoHS Status ROHS3 Compliant
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DSP56303VL100 Documents

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