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BZA418A,165 Tech Specifications

NXP  BZA418A,165 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case SC-74, SOT-457
Surface Mount YES
Diode Element Material SILICON
Number of Elements 4 Elements
Power Dissipation (Max) 0.72W
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
ECCN Code EAR99
Type Zener
Terminal Finish Tin (Sn)
Applications General Purpose
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BZA4*A
Pin Count 6
JESD-30 Code R-PDSO-G6
Polarity UNIDIRECTIONAL
Power Line Protection No
Power - Peak Pulse 19.6W
Voltage - Clamping (Max) @ Ipp 27V
Voltage - Reverse Standoff (Typ) 18V
Unidirectional Channels 4
Rep Pk Reverse Voltage-Max 18V
Capacitance @ Frequency 48pF @ 1MHz
Non-rep Peak Rev Power Dis-Max 19.6W
Clamping Voltage-Max 27V
RoHS Status ROHS3 Compliant
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BZA418A,165 Documents

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