BZA100,118 Tech Specifications

NXP  BZA100,118 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Diode Element Material SILICON
Breakdown Voltage / V 6.8V
Number of Elements 18 Elements
Operating Temperature (Max.) 150°C
Power Dissipation (Max) 1.25W
Packaging Tape & Reel (TR)
Published 2007
JESD-609 Code e4
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20Terminations
ECCN Code EAR99
Type Zener
Terminal Finish NICKEL PALLADIUM GOLD
Applications General Purpose
HTS Code 8541.10.00.50
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BZA100
Pin Count 20
JESD-30 Code R-PDSO-G20
Polarity UNIDIRECTIONAL
Power Line Protection No
Power - Peak Pulse 27.5W
Voltage - Clamping (Max) @ Ipp 11V
Voltage - Reverse Standoff (Typ) 6.8V
Unidirectional Channels 18
JEDEC-95 Code MS-013AC
Capacitance @ Frequency 120pF @ 1MHz
Non-rep Peak Rev Power Dis-Max 27.5W
Reverse Current-Max 2μA
Clamping Voltage-Max 11V
Diode Capacitance-Min 120pF
RoHS Status ROHS3 Compliant
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BZA100,118 Documents

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BZA100,118 brand manufacturers: NXP USA Inc., Twicea stock, BZA100,118 reference price.NXP USA Inc.. BZA100,118 parameters, BZA100,118 Datasheet PDF and pin diagram description download.You can use the BZA100,118 TVS - Diodes, DSP Datesheet PDF, find BZA100,118 pin diagram and circuit diagram and usage method of function,BZA100,118 electronics tutorials.You can download from the Twicea.