BUK7219-55A Tech Specifications

NXP  BUK7219-55A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 2Terminals
Transistor Element Material SILICON
Package Description PLASTIC, TO-252, SC-63, DPAK, 3 PIN
Package Style SMALL OUTLINE
Moisture Sensitivity Levels 1
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 175 °C
Rohs Code Yes
Manufacturer Part Number BUK7219-55A
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 1 Element
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.23
Part Package Code TO-252AA
Drain Current-Max (ID) 55 A
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Tin (Sn)
Subcategory FET General Purpose Power
Terminal Position SINGLE
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
Pin Count 3
JESD-30 Code R-PSSO-G2
Qualification Status Not Qualified
Configuration SINGLE WITH BUILT-IN DIODE
Operating Mode ENHANCEMENT MODE
Case Connection DRAIN
Transistor Application SWITCHING
Polarity/Channel Type N-CHANNEL
JEDEC-95 Code TO-252AA
Drain Current-Max (Abs) (ID) 55 A
Drain-source On Resistance-Max 0.019 Ω
Pulsed Drain Current-Max (IDM) 250 A
DS Breakdown Voltage-Min 55 V
Avalanche Energy Rating (Eas) 120 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs) 114 W
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