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BGM1014,115 Tech Specifications

NXP  BGM1014,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Surface Mount YES
Operating Temperature (Max.) 85°C
Operating Temperature (Min.) -40°C
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
Terminal Finish Tin (Sn)
Additional Feature LOW NOISE
HTS Code 8542.33.00.01
Voltage - Supply 5V~6V
Number of Functions 1Function
Construction COMPONENT
Frequency 0Hz~2.2GHz
Pin Count 6
Power Supplies 5V
Test Frequency 1GHz
Current - Supply 17mA~25mA
Gain 31.5dB ~ 33dB
RF/Microwave Device Type WIDE BAND LOW POWER
RF Type ISM
Input Power-Max (CW) -10dBm
Characteristic Impedance 50Ohm
Noise Figure 4.2dB ~ 4.3dB
P1dB 12.5dBm ~ 12.9dBm
RoHS Status ROHS3 Compliant
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BGM1014,115 Documents

Download datasheets and manufacturer documentation for   BGM1014,115

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