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BGA7350,115 Tech Specifications

NXP  BGA7350,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Surface Mount YES
Package / Case 32-VFQFN Exposed Pad
Mounting Type Surface Mount
Operating Temperature (Min.) -40°C
Operating Temperature (Max.) 85°C
Published 2017
Packaging Tape & Reel (TR)
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 32Terminations
Voltage - Supply 4.75V~5.25V
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 5V
Terminal Pitch 0.5mm
Frequency 50MHz~250MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 32
JESD-30 Code S-PQCC-N32
Temperature Grade INDUSTRIAL
Test Frequency 50MHz
Current - Supply 245mA
Gain 19.5dB
Telecom IC Type RF AND BASEBAND CIRCUIT
RF Type General Purpose
Noise Figure 6dB
P1dB 17dBm
Width 5mm
Height Seated (Max) 1mm
Length 5mm
RoHS Status ROHS3 Compliant
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BGA7350,115 Documents

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