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BF862,215 Tech Specifications
NXP BF862,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Surface Mount | YES | |
| Transistor Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Operating Temperature (Max.) | 150°C | |
| Voltage Rated | 20V | |
| Packaging | Tape & Reel (TR) | |
| Published | 1999 | |
| JESD-609 Code | e3 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| HTS Code | 8541.21.00.75 | |
| Current Rating (Amps) | 25mA | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | BF862 | |
| Pin Count | 3 | |
| JESD-30 Code | R-PDSO-G3 | |
| Qualification Status | Not Qualified | |
| Configuration | SINGLE | |
| Operating Mode | DEPLETION MODE | |
| Transistor Application | AMPLIFIER | |
| Transistor Type | N-Channel JFET | |
| JEDEC-95 Code | TO-236AB | |
| Drain Current-Max (Abs) (ID) | 0.04A | |
| DS Breakdown Voltage-Min | 20V | |
| FET Technology | JUNCTION | |
| Power Dissipation-Max (Abs) | 0.225W | |
| RoHS Status | ROHS3 Compliant |
BF862,215 Documents
Download datasheets and manufacturer documentation for BF862,215
- PCN PackagingCarrier Tapes 31/Aug/2016 Lighter Reels 02/Jan/2014
- DatasheetsBF862
- PCN Obsolescence/ EOLMult Devices 27/Jul/2017
- PCN Assembly/OriginMFG Name Change Nexperia 5/Mar/2017
- Environmental InformationNXP RoHS3 Cert
- PCN Design/SpecificationResin Hardener 02/Jul/2013
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