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BB135,135 Tech Specifications

NXP  BB135,135 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case SC-76, SOD-323
Surface Mount YES
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -55°C~125°C TJ
Packaging Tape & Reel (TR)
Published 1998
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BB135
Pin Count 2
JESD-30 Code R-PDSO-G2
Qualification Status Not Qualified
Diode Type Single
Capacitance @ Vr, F 2.1pF @ 28V 1MHz
Reverse Current-Max 0.01μA
Voltage - Peak Reverse (Max) 30V
Breakdown Voltage-Min 30V
Reverse Test Voltage 30V
Frequency Band ULTRA HIGH FREQUENCY
Diode Capacitance-Nom 19.25pF
Capacitance Ratio 12
Capacitance Ratio Condition C0.5/C28
RoHS Status ROHS3 Compliant
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BB135,135 Documents

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BB135,135 brand manufacturers: NXP USA Inc., Twicea stock, BB135,135 reference price.NXP USA Inc.. BB135,135 parameters, BB135,135 Datasheet PDF and pin diagram description download.You can use the BB135,135 Diodes - Variable Capacitance (Varicaps, Varactors), DSP Datesheet PDF, find BB135,135 pin diagram and circuit diagram and usage method of function,BB135,135 electronics tutorials.You can download from the Twicea.