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BAP55LX,315 Tech Specifications

NXP  BAP55LX,315 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 16 Weeks
Package / Case 2-XDFN
Surface Mount YES
Diode Element Material SILICON
Number of Elements 1 Element
Power Dissipation (Max) 135mW
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Terminal Finish Tin (Sn)
Applications ATTENUATOR; SWITCHING
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP55
Pin Count 2
JESD-30 Code R-PDSO-N2
Qualification Status Not Qualified
Diode Type PIN - Single
Capacitance @ Vr, F 0.28pF @ 20V 1MHz
Voltage - Peak Reverse (Max) 50V
Breakdown Voltage-Min 50V
Reverse Test Voltage 20V
Frequency Band S B
Diode Capacitance-Nom 0.28pF
Resistance @ If, F 800mOhm @ 100mA 100MHz
Diode Capacitance-Max 0.28pF
Minority Carrier Lifetime-Nom 0.27 µs
Diode Res Test Current 0.5mA
Diode Res Test Frequency 100MHz
Diode Forward Resistance-Max 4.5Ohm
RoHS Status ROHS3 Compliant
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BAP55LX,315 Documents

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BAP55LX,315 brand manufacturers: NXP USA Inc., Twicea stock, BAP55LX,315 reference price.NXP USA Inc.. BAP55LX,315 parameters, BAP55LX,315 Datasheet PDF and pin diagram description download.You can use the BAP55LX,315 Diodes - RF, DSP Datesheet PDF, find BAP55LX,315 pin diagram and circuit diagram and usage method of function,BAP55LX,315 electronics tutorials.You can download from the Twicea.