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74HCT259N Tech Specifications

NXP  74HCT259N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 16Terminals
Package Description DIP, DIP16,.3
Package Style IN-LINE
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP16,.3
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number 74HCT259N
Supply Voltage-Nom (Vsup) 5 V
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 8.5
Prop. 51 ns
Subcategory FF/Latches
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T16
Qualification Status Not Qualified
Power Supplies 5 V
Temperature Grade INDUSTRIAL
Number of Bits 8Bits
Logic IC Type D LATCH
Max I(ol) 0.004 A
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