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74HC373N Tech Specifications

NXP  74HC373N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Through Hole
Surface Mount NO
Number of Pins 20Pins
Number of Terminals 20Terminals
Number of Elements 1 Element
RoHS Compliant
Package Style IN-LINE
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP20,.3
Operating Temperature-Min -40 °C
Operating Temperature-Max 125 °C
Rohs Code Yes
Manufacturer Part Number 74HC373N
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 4.47
Prop. 45 ns
Packaging Bulk
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature 125 °C
Min Operating Temperature -40 °C
Subcategory FF/Latches
Packing Method BULK PACK
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T20
Qualification Status Not Qualified
Operating Supply Voltage 5 V
Polarity Non-Inverting
Power Supplies 2/6 V
Temperature Grade AUTOMOTIVE
Voltage 6 V
Number of Circuits 8Circuits
Max Supply Voltage 6 V
Min Supply Voltage 2 V
Number of Bits 8Bits
Propagation Delay 265 ns
Logic Function Latch
Output Characteristics 3-STATE
Logic IC Type D LATCH
Max I(ol) 0.006 A
High Level Output Current -7.8 mA
Low Level Output Current 7.8 mA
REACH SVHC No SVHC
Radiation Hardening No
Lead Free Lead Free
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