NXP USA Inc. 74HC112DB Flip Flops
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74HC112DB Tech Specifications
NXP 74HC112DB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 16Terminals | |
| Package Description | SSOP, SSOP16,.3 | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Moisture Sensitivity Levels | 1 | |
| Load Capacitance (CL) | 50 pF | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | SSOP16,.3 | |
| Operating Temperature-Min | -40 °C | |
| Operating Temperature-Max | 125 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 74HC112DB | |
| Package Code | SSOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Philips Semiconductors | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Max | 20000000 Hz | |
| Risk Rank | 5.69 | |
| Subcategory | FF/Latches | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Number of Functions | 2Functions | |
| Terminal Pitch | 0.635 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDSO-G16 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 2/6 V | |
| Temperature Grade | AUTOMOTIVE | |
| Logic IC Type | J-K FLIP-FLOP | |
| Max I(ol) | 0.004 A | |
| Trigger Type | NEGATIVE EDGE |
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