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74HC00PW Tech Specifications

NXP  74HC00PW technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 14Terminals
Package Description TSSOP, TSSOP14,.25
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Moisture Sensitivity Levels 1
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP14,.25
Operating Temperature-Min -40 °C
Operating Temperature-Max 125 °C
Rohs Code Yes
Manufacturer Part Number 74HC00PW
Package Code TSSOP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 8.51
Prop. 27 ns
Subcategory Gates
Packing Method TUBE
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Reach Compliance Code unknown
JESD-30 Code R-PDSO-G14
Qualification Status Not Qualified
Power Supplies 2/6 V
Temperature Grade AUTOMOTIVE
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Schmitt Trigger NO
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