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UJA1169ATK/3 Tech Specifications

NXP  UJA1169ATK/3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material aluminium
Number of Terminals 20Terminals
Type of heatsink extruded
Heatsink shape round
Colour black
Material finishing anodized
Mounting heat transfer glue,
Internal diameter 60mm
Gross weight 700 g
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description HVSON-20
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Equivalence Code SOLCC20,.14,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom 13 V
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-N20
Supply Current-Max 67 mA
Data Rate 15000 Mbps
Seated Height-Max 1 mm
Screening Level AEC-Q100
Telecom IC Type CAN FD TRANSCEIVER
Number of Transceivers 1Transceiver
2nd Connector Number of Positions Loaded LED
Diameter 120mm
Length 5.5 mm
Width 3.5 mm
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UJA1169ATK/3 Documents

Download datasheets and manufacturer documentation for   UJA1169ATK/3

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