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TJA1052IT/5 Tech Specifications

NXP  TJA1052IT/5 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material aluminium
Number of Terminals 16Terminals
Type of heatsink extruded
Heatsink shape grilled
Colour black
Material finishing anodized
Mounting for back plate
Plate thickness 1.8mm
Gross weight 700 g
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 7.50 MM, PLASTIC, SOT162-1, MS-013, SOP-16
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Supply Voltage-Nom 5 V
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-G16
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
Supply Current-Max 0.07 mA
Data Rate 1000 Mbps
Seated Height-Max 2.65 mm
Screening Level AEC-Q100
Telecom IC Type INTERFACE CIRCUIT
Number of Transceivers 1Transceiver
2nd Connector Number of Positions Loaded universal
Height 14mm
Length 10.3 mm
Width 7.5 mm
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TJA1052IT/5 Documents

Download datasheets and manufacturer documentation for   TJA1052IT/5

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