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TJA1027TK/20 Tech Specifications

NXP  TJA1027TK/20 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 4pins
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SON
Package Description 3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT782-1, HVSON-8
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom 12 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x4
Gross weight 0.2 g
Operating temperature -40...163°C
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Current rating 3A
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code S-PDSO-N8
Seated Height-Max 1 mm
Telecom IC Type INTERFACE CIRCUIT
Rated voltage 150V
Profile beryllium copper
Saturation Current 1
Length 3 mm
Width 3 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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TJA1027TK/20 Documents

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