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TEA1118M/C2 Tech Specifications

pSemi  TEA1118M/C2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 16Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description PLASTIC, SOT-369, SSOP-16
Operating Temperature-Max 75 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code LSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Supply Voltage-Nom 2.9 V
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 16
JESD-30 Code R-PDSO-G16
Qualification Status Not Qualified
Temperature Grade COMMERCIAL EXTENDED
Supply Current-Max 1.4 mA
Seated Height-Max 1.5 mm
Telecom IC Type CORDLESS TELEPHONE BASEBAND CIRCUIT
Length 5.2 mm
Width 4.4 mm
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TEA1118M/C2 Documents

Download datasheets and manufacturer documentation for   TEA1118M/C2

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