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TDA18250BHN/C1 Tech Specifications

NXP  TDA18250BHN/C1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 3pins
Number of Terminals 32Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, ROHS COMPLIANT, HVQFN-32
Package Body Material PLASTIC/EPOXY
Package Code QCCN
Package Shape SQUARE
Package Style CHIP CARRIER
Supply Voltage-Nom 3.3 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x3
Gross weight 0.11 g
Operating temperature -40...163°C
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
Current rating 1.5A
JESD-30 Code S-PQCC-N32
Telecom IC Type TELECOM CIRCUIT
Rated voltage 60V
Profile beryllium copper
Plating thickness 0.254µm
Flammability rating UL94V-0
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TDA18250BHN/C1 Documents

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