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SL3S1203FTB0 Tech Specifications

NXP  SL3S1203FTB0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 4pins
Number of Terminals 6Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SON
Package Description XSON-6
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE
Supply Voltage-Nom 1.8 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x4
Gross weight 0.19 g
Operating temperature -40...163°C
JESD-609 Code e3
Terminal Finish Tin (Sn)
HTS Code 8542.32.00
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Current rating 1.5A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 6
JESD-30 Code R-PDSO-N6
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Seated Height-Max 0.5 mm
Telecom IC Type TELECOM CIRCUIT
Rated voltage 60V
Profile beryllium copper
Saturation Current 1
Length 1.45 mm
Width 1 mm
Plating thickness 0.254µm
Flammability rating UL94V-0
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SL3S1203FTB0 Documents

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