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74LVC244APW Tech Specifications

NXP  74LVC244APW technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material aluminium
Number of Terminals 20Terminals
Transport packaging size/quantity 28.5*21*19/2000
Maximum current 24 A
Noal voltage 30 (AC/ DC) Vmin
Mounting hole size 6 mm
Soldering seat diameter 2.5 mm
Type of heatsink extruded
Heatsink shape grilled
Colour black
Material finishing anodized
Mounting for back plate
Plate thickness 15mm
Gross weight 700 g
Supply Voltage-Nom (Vsup) 1.8 V
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
Load Capacitance (CL) 50 pF
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP20,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-609 Code e4
Pbfree Code Yes
ECCN Code EAR99
Type device terminal (F), Ф4 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Color yellow
HTS Code 8542.39.00.01
Packing Method TUBE
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 2Functions
Terminal Pitch 0.65 mm
Depth 22 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 20
JESD-30 Code R-PDSO-G20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 1.2 V
Number of Ports 2Ports
Number of Bits 4Bits
Family LVC/LCX/Z
Output Characteristics 3-STATE
Seated Height-Max 1.1 mm
Output Polarity TRUE
Logic IC Type BUS DRIVER
Max I(ol) 0.024 A
Prop. Delay@Nom-Sup 7.5 ns
Propagation Delay (tpd) 15.8 ns
Control Type ENABLE LOW
2nd Connector Number of Positions Loaded universal
Saturation Current 1
Diameter 10 mm
Height 84mm
Width 4.4 mm
Length 6.5 mm
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74LVC244APW Documents

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