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74CBTLV3126BQ-Q100 Tech Specifications

NXP  74CBTLV3126BQ-Q100 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 14pins
Number of Terminals 14Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN
Package Description 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, QFN-14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Shape RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom (Vsup) 3.3 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 2x7
Row pitch 2.54mm
Gross weight 1.28 g
Operating temperature -40...163°C
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 4Functions
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Current rating 1.5A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 14
JESD-30 Code R-PQCC-N14
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 2.3 V
Number of Ports 2Ports
Number of Bits 1Bit
Family CBTLV/3B
Output Characteristics 3-STATE
Seated Height-Max 1 mm
Output Polarity TRUE
Logic IC Type BUS DRIVER
Screening Level AEC-Q100
Propagation Delay (tpd) 0.31 ns
Rated voltage 60V
Profile beryllium copper
Saturation Current 1
Length 3 mm
Width 2.5 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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74CBTLV3126BQ-Q100 Documents

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