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MC33SB0400ESR2 Tech Specifications

NXP  MC33SB0400ESR2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 4-SMD, No Lead
Surface Mount YES
Number of Terminals 48Terminals
Package Tape & Reel (TR)
Mfr SiTime
Product Status Active
Mounting Surface Mount
Package Description QFN-48
Package Style CHIP CARRIER, HEAT SINK/SLUG
Moisture Sensitivity Levels 3
Package Body Material UNSPECIFIED
Operating Temperature-Min -40 °C
Supply Voltage-Nom 5 V
Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Min 4.75 V
Operating Temperature-Max 125 °C
Rohs Code Yes
Manufacturer Part Number MC33SB0400ESR2
Package Code HQCCN
Package Shape SQUARE
Manufacturer NXP Semiconductors
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Supply Voltage-Max 5.25 V
Risk Rank 5.64
Operating Temperature -20°C ~ 70°C
Series SiT8208
Size / Dimension 0.126 L x 0.098 W (3.20mm x 2.50mm)
Type XO (Standard)
HTS Code 8542.39.00.01
Technology MOS
Voltage - Supply 2.8V
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Reach Compliance Code compliant
Frequency 40 MHz
Frequency Stability ±10ppm
Output LVCMOS, LVTTL
JESD-30 Code S-XQCC-N48
Function Enable/Disable
Base Resonator MEMS
Current - Supply (Max) 33mA
Operating Supply Voltage 3.3000, 5.0000 V
Temperature Grade AUTOMOTIVE
Current - Supply (Disable) (Max) 31mA
Spread Spectrum Bandwidth -
Interface IC Type INTERFACE CIRCUIT
Absolute Pull Range (APR) -
Height Seated (Max) 0.031 (0.80mm)
Ratings -
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