BFQ67W Tech Specifications

NXP  BFQ67W technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Tin
Mount Through Hole
Surface Mount YES
Number of Terminals 3Terminals
Transistor Element Material SILICON
RoHS Non-Compliant
Risk Rank 5.64
Part Package Code SC-70
Ihs Manufacturer NXP SEMICONDUCTORS
Part Life Cycle Code Obsolete
Number of Elements 1 Element
Manufacturer NXP Semiconductors
Package Shape RECTANGULAR
Manufacturer Part Number BFQ67W
Transition Frequency-Nom (fT) 8000 MHz
Rohs Code Yes
Operating Temperature-Max 150 °C
Reflow Temperature-Max (s) 30
Package Body Material PLASTIC/EPOXY
Package Style SMALL OUTLINE
Package Description PLASTIC, SC-70, 3 PIN
Tolerance 1 %
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Temperature Coefficient 50 ppm/°C
Resistance 4.64 MΩ
Terminal Finish Tin (Sn)
Composition Metal Film
Additional Feature LOW NOISE, HIGH RELIABILITY
HTS Code 8541.21.00.75
Subcategory Other Transistors
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Reach Compliance Code compliant
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Configuration SINGLE
Transistor Application AMPLIFIER
Polarity/Channel Type NPN
Collector Emitter Voltage (VCEO) 10 V
Power Dissipation-Max (Abs) 0.3 W
Collector Current-Max (IC) 0.05 A
DC Current Gain-Min (hFE) 60
Collector-Emitter Voltage-Max 10 V
Highest Frequency Band L BAND
Power Dissipation Ambient-Max 0.3 W
Length 6.5 mm
Diameter 2.5 mm
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