BF1211R Tech Specifications

NXP  BF1211R technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 4Terminals
Transistor Element Material SILICON
Voltage, Rating 100 V
Package Description PLASTIC, SC-61B, 4 PIN
Package Style SMALL OUTLINE
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 150 °C
Rohs Code Yes
Manufacturer Part Number BF1211R
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 2 Elements
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.77
Part Package Code SC-61B
Drain Current-Max (ID) 0.03 A
Tolerance 0.25 %
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Temperature Coefficient 50 ppm/°C
Resistance 9.09 Ω
Terminal Finish Tin (Sn)
Max Operating Temperature 155 °C
Min Operating Temperature -55 °C
Composition Thin Film
Additional Feature LOW NOISE
Subcategory FET General Purpose Power
Power Rating 125 mW
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Pin Count 4
JESD-30 Code R-PDSO-G4
Qualification Status Not Qualified
Configuration COMPLEX
Operating Mode DUAL GATE, ENHANCEMENT MODE
Case Connection SOURCE
Transistor Application AMPLIFIER
Polarity/Channel Type N-CHANNEL
Drain Current-Max (Abs) (ID) 0.03 A
DS Breakdown Voltage-Min 6 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs) 0.18 W
Feedback Cap-Max (Crss) 0.03 pF
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
Height 650 µm
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