BF1206 Tech Specifications

NXP  BF1206 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Panel Mount, Through Hole
Surface Mount YES
Mounting Feature Flange
Shell Material Aluminum
Number of Terminals 6Terminals
Transistor Element Material SILICON
Package Retail Package
Primary Material Metal
Mfr Glenair
Product Status Active
Contact Materials Copper Alloy
Contact Finish Mating Gold
Package Description PLASTIC, SC-88, 6 PIN
Package Style SMALL OUTLINE
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 150 °C
Rohs Code Yes
Manufacturer Part Number BF1206
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 2 Elements
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.74
Part Package Code SC-88
Drain Current-Max (ID) 0.03 A
Operating Temperature -65°C ~ 175°C
Series 806
JESD-609 Code e3
Pbfree Code Yes
Termination Solder
ECCN Code EAR99
Connector Type Plug, Male Pins
Terminal Finish Tin (Sn)
Color Olive Drab
Fastening Type Threaded
Subcategory FET General Purpose Power
Terminal Position DUAL
Orientation E
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Shell Finish Olive Drab Cadmium
Pin Count 6
Shell Size - Insert 24-5
JESD-30 Code R-PDSO-G6
Qualification Status Not Qualified
Configuration COMPLEX
Operating Mode DUAL GATE, ENHANCEMENT MODE
Transistor Application AMPLIFIER
Polarity/Channel Type N-CHANNEL
Drain Current-Max (Abs) (ID) 0.03 A
DS Breakdown Voltage-Min 6 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs) 0.18 W
Feedback Cap-Max (Crss) 0.03 pF
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
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