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74HC4060PW，112 Tech Specifications

NXP  74HC4060PW，112 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case 16-TSSOP (0.173, 4.40mm Width)
Supplier Device Package 16-TSSOP
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 26 (2 x 13)
Contact Material - Mating Beryllium Copper
Contact Material - Post Phosphor Bronze
Contact Finish Mating Gold
Package Bulk
Base Product Number 74HC4060
Mfr NXP Semiconductors
Product Status Active
Number of Elements 1 Element
Operating Temperature -55°C ~ 105°C
Series 503
Packaging Bulk
Part Status Active
Termination Wire Wrap
Type DIP, 0.3 (7.62mm) Row Spacing
Voltage - Supply 2 V ~ 6 V
Current Rating 3A
Pitch - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Resistance --
Reset Asynchronous
Direction Up
Logic Type Binary Counter
Number of Bits per Element 14Bits per Elements
Trigger Type Negative Edge
Termination Post Length 0.360 (9.14mm)
Pitch - Post 0.100 (2.54mm)
Count Rate 95 MHz
Timing -
Features Closed Frame
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish Thickness - Post 200.0µin (5.08µm)
Material Flammability Rating UL94 V-0
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