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PMV65XP,215 Tech Specifications
Nexperia PMV65XP,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 4 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Surface Mount | YES | |
| Number of Pins | 3Pins | |
| Transistor Element Material | SILICON | |
| Current - Continuous Drain (Id) @ 25℃ | 2.8A Ta | |
| Drive Voltage (Max Rds On, Min Rds On) | 1.8V 4.5V | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 480mW Ta | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Published | 2011 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| Additional Feature | LOW THRESHOLD | |
| HTS Code | 8541.29.00.75 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Pin Count | 3 | |
| Qualification Status | Not Qualified | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 1.92W | |
| FET Type | P-Channel | |
| Transistor Application | SWITCHING | |
| Rds On (Max) @ Id, Vgs | 74m Ω @ 2.8A, 4.5V | |
| Vgs(th) (Max) @ Id | 900mV @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 744pF @ 20V | |
| Gate Charge (Qg) (Max) @ Vgs | 7.7nC @ 4.5V | |
| Drain to Source Voltage (Vdss) | 20V | |
| Vgs (Max) | ±12V | |
| Continuous Drain Current (ID) | -3.9A | |
| Drain-source On Resistance-Max | 0.076Ohm | |
| DS Breakdown Voltage-Min | 20V | |
| RoHS Status | ROHS3 Compliant |
PMV65XP,215 Documents
Download datasheets and manufacturer documentation for PMV65XP,215
- PCN PackagingPack/Label Update 30/Nov/2016 Lighter Reels 02/Jan/2014
- DatasheetsPMV65XP,215-Nexperia-datasheet-78342107.pdf PMV65XP PMV65XP,215-NXP-datasheet-89234.pdf
- PCN Design/SpecificationCopper Bond Wire 18/Apr/2014
- RohsStatementNXP-Semiconductors-company-12.pdf
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