BAW56,215 Tech Specifications

Nexperia  BAW56,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Surface Mount YES
Package / Case TO-236-3, SC-59, SOT-23-3
Mounting Type Surface Mount
Number of Pins 3Pins
Diode Element Material SILICON
Power Dissipation (Max) 0.25W
Number of Elements 2 Elements
Published 2007
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAW56
Pin Count 3
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 500nA @ 80V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 150mA
Forward Current 125mA
Operating Temperature - Junction 150°C Max
Output Current-Max 0.215A
Current - Average Rectified (Io) 215mA DC
Forward Voltage 1.25V
Reverse Recovery Time 4ns
Peak Reverse Current 150μA
Max Repetitive Reverse Voltage (Vrrm) 90V
Reverse Voltage 90V
Diode Configuration 1 Pair Common Anode
Max Forward Surge Current (Ifsm) 4A
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 150°C
Height 1.1mm
RoHS Status ROHS3 Compliant
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