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- UPD4616112F9-B85LX-BC2
NEC Electronics Group UPD4616112F9-B85LX-BC2 Memory ICs
UPD4616112F9-B85LX-BC2
1712-535-UPD4616112F9-B85LX-BC2
RoHS Compliant
Terminal Position: BOTTOM
In Stock Min. : 1
Mult. : 1
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UPD4616112F9-B85LX-BC2 Tech Specifications
NEC UPD4616112F9-B85LX-BC2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 48Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NEC ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Access Time-Max | 85 ns | |
| Number of Words | 1048576 wordsWord | |
| Number of Words Code | 1000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| ECCN Code | 3A991.B.2.A | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.32.00.41 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.75 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 48 | |
| JESD-30 Code | R-PBGA-B48 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.1 V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 2.6 V | |
| Operating Mode | ASYNCHRONOUS | |
| Organization | 1MX16 | |
| Seated Height-Max | 1.04 mm | |
| Memory Width | 16 | |
| Memory Density | 16777216 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | STANDARD SRAM | |
| Length | 8 mm | |
| Width | 6 mm |
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