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XPC860DHZP66C1 Tech Specifications

Motorola Semiconductor Products  XPC860DHZP66C1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 357Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description PLASTIC, BGA-357
Clock Frequency-Max 66 MHz
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
JESD-609 Code e0
ECCN Code 3A991.A.2
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.05 mm
Address Bus Width 32
External Data Bus Width 32
Length 25 mm
Width 25 mm
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XPC860DHZP66C1 Documents

Download datasheets and manufacturer documentation for   XPC860DHZP66C1

  • Datasheets
XPC860DHZP66C1 brand manufacturers: Motorola Semiconductor Products, Twicea stock, XPC860DHZP66C1 reference price.Motorola Semiconductor Products. XPC860DHZP66C1 parameters, XPC860DHZP66C1 Datasheet PDF and pin diagram description download.You can use the XPC860DHZP66C1 Embedded - Microprocessors, DSP Datesheet PDF, find XPC860DHZP66C1 pin diagram and circuit diagram and usage method of function,XPC860DHZP66C1 electronics tutorials.You can download from the Twicea.