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XPC823VF66B2 Tech Specifications

Motorola Semiconductor Products  XPC823VF66B2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 256Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description BGA, BGA256,16X16,40
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 1.75 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Length 17 mm
Width 17 mm
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XPC823VF66B2 Documents

Download datasheets and manufacturer documentation for   XPC823VF66B2

  • Datasheets
XPC823VF66B2 brand manufacturers: Motorola Semiconductor Products, Twicea stock, XPC823VF66B2 reference price.Motorola Semiconductor Products. XPC823VF66B2 parameters, XPC823VF66B2 Datasheet PDF and pin diagram description download.You can use the XPC823VF66B2 Embedded - Microprocessors, DSP Datesheet PDF, find XPC823VF66B2 pin diagram and circuit diagram and usage method of function,XPC823VF66B2 electronics tutorials.You can download from the Twicea.