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XPC7450RX600LE Tech Specifications

Motorola Semiconductor Products  XPC7450RX600LE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 483Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483
Clock Frequency-Max 133 MHz
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 1.85 V
Supply Voltage-Min 1.55 V
Supply Voltage-Nom 1.6 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-CBGA-B483
Qualification Status Not Qualified
Speed 600 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 3.22 mm
Address Bus Width 36
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Length 29 mm
Width 29 mm
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XPC7450RX600LE Documents

Download datasheets and manufacturer documentation for   XPC7450RX600LE

  • Datasheets
XPC7450RX600LE brand manufacturers: Motorola Semiconductor Products, Twicea stock, XPC7450RX600LE reference price.Motorola Semiconductor Products. XPC7450RX600LE parameters, XPC7450RX600LE Datasheet PDF and pin diagram description download.You can use the XPC7450RX600LE Embedded - Microprocessors, DSP Datesheet PDF, find XPC7450RX600LE pin diagram and circuit diagram and usage method of function,XPC7450RX600LE electronics tutorials.You can download from the Twicea.