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MC68HC705C9ACFN Tech Specifications

Motorola Semiconductor Products  MC68HC705C9ACFN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Body material PA66 UL94V-0
Number of Terminals 44Terminals
Bundle Center to Mounting Center 15932
Gross weight 4.93
Transport packaging size/quantity 46*36*36/5000
Name Construction mounting terminal block
Purpose for connecting copper wire cores
Mounting method on cable
Number of terals 8minteral
Contact material copper with tin plating
Nominal voltage (AC) 450 V
Max current 20 A
Wire cross-section 0.75...2.5 mm2
Dielectric strength 2000 (50Hz, 1 min.) V
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Package Description PLASTIC, LCC-44
Clock Frequency-Max 4.2 MHz
Number of I/O Lines 31I/O Lines
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC44,.7SQ
Package Shape SQUARE
Package Style CHIP CARRIER
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature CAN ALSO OPERATE AT 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form J BEND
Terminal Pitch 1.27 mm
Depth 19.5 mm
Reach Compliance Code unknown
JESD-30 Code S-PQCC-J44
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Insulation resistance ≥500 (at Utest.dc=500V) MOhm
Speed 2.1 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 5.25 mA
Bit Size 8
Has ADC NO
DMA Channels NO
PWM Channels NO
DAC Channels NO
Seated Height-Max 4.57 mm
Operating temperature range -40…+105 °C
Coil Type 352
On Chip Program ROM Width 8
CPU Family 6805
ROM Programmability OTPROM
Height 13.1 mm
Length 16.585 mm
Width 16.585 mm
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MC68HC705C9ACFN Documents

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