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DSP56L307VF150 Tech Specifications

Motorola Semiconductor Products  DSP56L307VF150 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 196Terminals
Supply Voltage-Nom 1.8 V
Supply Voltage-Min 1.7 V
Supply Voltage-Max 1.9 V
Package Style GRID ARRAY, LOW PROFILE
Package Shape SQUARE
Package Equivalence Code BGA196,14X14,40
Package Code LBGA
Package Body Material PLASTIC/EPOXY
Clock Frequency-Max 150 MHz
Package Description MOLD ARRAY PROCESS, BGA-196
Ihs Manufacturer MOTOROLA INC
Part Life Cycle Code Obsolete
Rohs Code No
JESD-609 Code e0
ECCN Code 3A991.A.2
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B196
Qualification Status Not Qualified
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Bit Size 24
Seated Height-Max 1.6 mm
Address Bus Width 18
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 24
Format FIXED POINT
RAM (words) 49152
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Width 15 mm
Length 15 mm
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DSP56L307VF150 Documents

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