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XPC862SRCZP66 Tech Specifications

Motorola Mobility LLC  XPC862SRCZP66 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 357Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA, BGA357,19X19,50
Clock Frequency-Max 66 MHz
Supply Voltage-Nom 3.3 V
Supply Voltage-Min 3.135 V
Supply Voltage-Max 3.465 V
Package Style GRID ARRAY
Package Shape SQUARE
Package Equivalence Code BGA357,19X19,50
Package Code BGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 357
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.05 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Width 25 mm
Length 25 mm
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XPC862SRCZP66 Documents

Download datasheets and manufacturer documentation for   XPC862SRCZP66

  • Datasheets
XPC862SRCZP66 brand manufacturers: Motorola Mobility LLC, Twicea stock, XPC862SRCZP66 reference price.Motorola Mobility LLC. XPC862SRCZP66 parameters, XPC862SRCZP66 Datasheet PDF and pin diagram description download.You can use the XPC862SRCZP66 Embedded - Microprocessors, DSP Datesheet PDF, find XPC862SRCZP66 pin diagram and circuit diagram and usage method of function,XPC862SRCZP66 electronics tutorials.You can download from the Twicea.