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XCB56007FJ50 Tech Specifications

Motorola Mobility LLC  XCB56007FJ50 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 80Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code QFP
Package Description LQFP, QFP80,.7SQ
Clock Frequency-Max 50 MHz
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Equivalence Code QFP80,.7SQ
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
JESD-609 Code e0
ECCN Code 3A991.A.2
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 80
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Supply Current-Max 105 mA
Bit Size 24
Seated Height-Max 1.6 mm
Address Bus Width 18
On Chip Program ROM Width 24
Boundary Scan NO
Low Power Mode YES
External Data Bus Width 8
Format FIXED POINT
Integrated Cache NO
RAM (words) 3200
Number of Serial I/Os 3Serial I/Os
ROM Programmability MROM
Number of External Interrupts 3External Interrupts
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
On Chip Data RAM Width 24
Length 14 mm
Width 14 mm
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XCB56007FJ50 Documents

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