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F16C20C Tech Specifications

MOSPEC  F16C20C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Material polyolefin
Diode Element Material SILICON
Number of Terminals 3Terminals
Exterior Housing Material 2
Type of capacitor ceramic
Kind of capacitor MLCC
Mounting SMD
Case - inch 1206
Case - mm 3216
Capacitors series KGM
Gross weight 8.30
Transport packaging size/quantity 103*26*25/1000
Diameter before shrinkage 3 mm
Diameter after shrinkage 1 mm
Wall thickness before shrinkage 0.42 mm
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer MOSPEC SEMICONDUCTOR CORP
Package Description R-PSFM-T3
Forward Voltage-Max (VF) 1.3 V
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Operating temperature -55...125°C
Packaging delivered in packs in multiples of 1.0 m
Tolerance ±1%
ECCN Code EAR99
Type Heat shrink tubing with adhesive layer
Color white
Additional Feature FREE WHEELING DIODE
HTS Code 8541.10.00.80
Capacitance 0.47nF
Terminal Position SINGLE
Terminal Form THROUGH-HOLE
Reach Compliance Code unknown
JESD-30 Code R-PSFM-T3
Dielectric C0G (NP0)
Working voltage ≤1500 V
Configuration COMMON CATHODE, 2 ELEMENTS
Note Diameter deviation up to shrinkage up to +1.5 mm is possible
Diode Type RECTIFIER DIODE
Case Connection CATHODE
Output Current-Max 8 A
Number of Phases 1Phase
Operating temperature range -55…+125 deg. C
Rep Pk Reverse Voltage-Max 200 V
JEDEC-95 Code TO-220AB
Non-rep Pk Forward Current-Max 150 A
Reverse Current-Max 10 μA
Shrink temperature 100 deg. C
Reverse Recovery Time-Max 0.15 μs
2nd Connector Number of Positions Loaded EFFICIENCY
Operating voltage 500V
Shrink ratio 3 : 1
Length 1000 mm
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F16C20C Documents

Download datasheets and manufacturer documentation for   F16C20C

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