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MSMBJ33CAE3 Tech Specifications

Microsemi  MSMBJ33CAE3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 13 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DO-214AA, SMB
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Reverse Stand-off Voltage 33V
Operating Temperature -65°C~150°C TJ
Packaging Bulk
Series Military, MIL-PRF-19500
Published 1997
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Type Zener
Terminal Finish Matte Tin (Sn) - annealed
Applications General Purpose
Additional Feature HIGH RELIABILITY
Terminal Position DUAL
Terminal Form J BEND
Pin Count 2
Polarity Bidirectional
Leakage Current 1μA
Element Configuration Single
Power Line Protection No
Current - Peak Pulse (10/1000μs) 11.3A
Max Reverse Leakage Current 1μA
Clamping Voltage 53.3V
Voltage - Reverse Standoff (Typ) 33V
Peak Pulse Current 11.3A
Peak Pulse Power 600W
Direction Bidirectional
Test Current 1mA
Reverse Breakdown Voltage 36.7V
Breakdown Voltage-Max 40.6V
RoHS Status Non-RoHS Compliant
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MSMBJ33CAE3 Documents

Download datasheets and manufacturer documentation for   MSMBJ33CAE3

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