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M2S090S-1FGG676I Tech Specifications

Microsemi  M2S090S-1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/Os 425I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S090S
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Flash Size 512KB
RoHS Status RoHS Compliant
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M2S090S-1FGG676I Documents

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