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M2S060-1FG676I Tech Specifications

Microsemi  M2S060-1FG676I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/Os 387I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 60K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant
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M2S060-1FG676I Documents

Download datasheets and manufacturer documentation for   M2S060-1FG676I

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